Flexible Electronics News

Applied Materials Joins EMC-3D Equipment and Materials Consortium

International alliance focused on developing cost-effective Through-Silicon Via (TSV) technology for next generation chips and sensors

Author Image

By: DAVID SAVASTANO

Editor, Ink World Magazine

The international EMC-3D semiconductor equipment and materials consortium today announced that Applied Materials, Inc. has joined the organization. As the industry’s leading provider of nanomanufacturing technology solutions, Applied offers critical process and integration expertise in the fields of etching, dielectric and metal deposition, chemical-mechanical polishing, metrology, and inspection. These capabilities will be utilized for developing a cost-effective and manufacturable through-sili...

Continue reading this story and get 24/7 access to Ink World magazine for FREE


Already a subscriber? Sign in

Keep Up With Our Content. Subscribe To Ink World magazine Newsletters